SUNON, the thermal solutions brand of Sunonwealth Electric Machine Industry Co., Ltd, has confirmed it will exhibit at the OCP Global Summit 2026, taking place October 12 to 15 at the San Jose McEnery Convention Center in San Jose, California, USA. The company's booth is A19.

Explore SUNON's Innovations in Liquid Cooling for AI Data Centers

The announcement was issued from Kaohsiung on September 29, 2026, and categorized under topics including computer hardware, semiconductors, and electronic components.

Visitors to the booth are invited to explore the company's latest liquid cooling technologies and products and to connect with the SUNON team to discuss the evolving thermal challenges and future trends shaping AI data centers.

The company's invitation to booth A19 carries the tagline: discover how SUNON is building the next generation of cooling for AI.

"Build to Chill" Frames the Showcase

At the summit, SUNON will present its latest liquid cooling innovations under the theme "Build to Chill."

The company describes the showcase as spanning from chips and servers to rack level solutions, presenting a comprehensive portfolio of liquid cooling technologies designed to address the evolving thermal demands of high-performance AI computing.

A secondary banner, "From Chip to Rack: Exploring Comprehensive Liquid Cooling Technologies for the AI Era," underscores the company's message that its portfolio covers multiple levels of AI computing infrastructure rather than a single point in the cooling chain.

Cooling Technologies Across Three Infrastructure Levels

The technologies on display in San Jose will cover three levels of the AI computing infrastructure: chip level, server level, and rack level.

SUNON states that by integrating thermal technologies across these levels, it aims to help customers address a wide range of power densities, operating environments, and system requirements, with solutions designed to deliver greater efficiency, reliability, and deployment flexibility.

The three-tier structure reflects the range of thermal challenges that accompany modern AI hardware, where cooling requirements can differ significantly depending on whether the target is the chip itself, the server enclosure, or the full rack deployment.

SUNON's stated goal is to provide solutions that flex across that spectrum rather than addressing each level in isolation.

AI Thermal Demands Behind the Product Push

The company frames the showcase against a backdrop of AI computing advancing at an unprecedented pace, a trend it says is creating new challenges for data center thermal management.

Rising chip power densities and increasing thermal loads in data centers are placing growing demands on cooling infrastructure, and SUNON positions liquid cooling as rapidly becoming a critical technology for supporting the next generation of AI infrastructure.

For attendees, booth A19 will serve as the venue for exploring the full portfolio, with the company's messaging centered on the idea that supporting high performance AI computing requires cooling strategies operating at every level of the infrastructure stack, from the chip where heat is generated, through the server that houses it, to the rack where systems are deployed at scale.

As power densities rise across AI data centers, SUNON is positioning its "Build to Chill" showcase as a demonstration of how integrated liquid cooling technologies can meet the efficiency, reliability, and deployment flexibility requirements of next generation AI infrastructure.

Return Engagement Following 2025 Summit

The 2026 appearance follows the company's participation in the previous year's event. According to related releases from the same source, SUNON unveiled next-generation liquid cooling systems at the OCP Global Summit 2025, where the company, described as a global leader in thermal solutions, showcased those systems.

The 2026 announcement indicates a continuation of the company's focus on liquid cooling as AI computing demands intensify.